• Electroplated Diamond Dicing Blade-1
  • Electroplated Diamond Dicing Blade-1

Electroplated Diamond Dicing Blade

   Electroplated diamond dicing blades with hub are used to groove, cut, and dice silicon, GaAs, glass, ceramic, quratz and compound semiconductor material in integrated chips and discrete devices production. This product has high precision and long life span. It's performance has achieved overseas advanced level.

Product Details

 Main Features
Diamond hub blade has the following features:
1. High precision
2. High toughness
3. Long life span
4. High performance
5. High efficiency
6. Easy use 
7. Short supply cycle
8. Wide range of application
Application
Silicon, GaAs, glass, ceramic, quartz and compound semiconductor material in integrated chips and discrete devices production.
Specification




Inquiry

  
×
Notice